摘要
介绍了半导体热电制冷的研究现状。设计了小型半导体恒温箱,对其结构进行了分析,建立了小型半导体恒温箱测试系统。探讨了环境温度、热端强制对流散热、自然对流散热对热端、冷端、恒温箱内温度的影响。分析了稳定工况下,对半导体芯片施加不同电压时,冷端温度及电功率变化。环境温度越低,热端采用强制对流散热时冷端的温度越低。当处于稳定工况时,施加的电压增大到一定值后,即使电压继续增大,冷端温度的变化也不明显。应在尽可能控制耗电量的前提下,选择最佳电压。
The research situation of semiconductor thermoelectric refrigeration is introduced. A small semiconductor thermostat is designed, its structure is analyzed, and the testing system of the ther- mostat is built. The influences of environmental temperature, forced convection heat dissipation and natu- ral convection heat dissipation on temperatures at the heat end, cold end and inside the thermostat are discussed. The changes of the cold end temperature and the power are analyzed when applying different voltages to the semiconductor chip under the stable condition. When the environmental temperature is low, and the forced convection heat dissipation is used at the heat end, the temperature at the cold end is low. When the applied voltage is increased to a certain extent under the stable condition, the temperature at the cold end does not change obviously even if the voltage is increased. The optimum voltage should be selected based on controlling the power consumption.
出处
《煤气与热力》
2012年第9期1-4,共4页
Gas & Heat
关键词
半导体热电制冷
恒温箱
半导体芯片
热端
冷端
最优电压
semiconductor thermoelectric refrigeration
thermostat
semiconductor chip
heat end
cold end
optimum voltage
