期刊文献+

微薄膜结构的湿法腐蚀技术研究

Process for wet etching of micro-film structure
下载PDF
导出
摘要 通过对流量传感器制造工艺中微薄膜结构的研究,分别介绍了采用氢氧化钾和四甲基氢氧化铵(TMAH)交替腐蚀实现感应薄膜释放的基本原理、工艺方法、工艺参数,及在制作流量芯片中的具体应用实例,实现了微米级厚度薄膜释放,为流量传感器和其它需要超薄薄膜微结构的制作奠定了基础。 Basic principles, process methods and process parameters of inducting films release by alternative etching of K0H and TMAH, and some specific applications in fabricating flow chips are introduced respectively by studying micro film structure in manufacturing process for flow sensor. Microsized film release is realized and fabricating foundation for flow sensor and other micro structure with ultra-thin film is established.
出处 《信息技术》 2012年第6期108-110,共3页 Information Technology
关键词 湿法腐蚀 薄膜释放 TMAH KOH wet etching film release TMAH KOH
  • 相关文献

参考文献9

  • 1Kenny TW, Kaiser W J, Waltman S B, et al. Novel infrared detec- tor based on a tunneling displacement transducer[J]. Appl Phys Lett, 1991,59(19) :1820. 被引量:1
  • 2张为,姚素英,刘艳艳,王涌萍,阎富兰,田莉萍,牛秀文.四甲基氢氧化铵在MEMS中的应用[J].微电子学,2001,31(6):422-424. 被引量:6
  • 3Shikida M, Sato K, Tokoro K, et al. Differences in anisotropic etching properties of KOH and TMAH solutions [ J ]. Sensors and Actuators, 2000,80 : 179 - 188. 被引量:1
  • 4邓俊泳,冯勇建.TMAH单晶硅腐蚀特性研究[J].微纳电子技术,2003,40(12):32-34. 被引量:13
  • 5黄庆安编著..硅微机械加工技术[M].北京:科学出版社,1996:259.
  • 6司俊杰,马斌.10%TMAH硅湿法腐蚀技术的研究[J].微细加工技术,2004(3):39-44. 被引量:5
  • 7Tabata O, Asahi R, Funabashi H, et al. Anisotropic etching of sili- con in ( CH3 ) 4 NOH solutions[ C ]. Anoned Proc Transducers. San Francisco (USA) :IEEE, 1991:811 -814. 被引量:1
  • 8Seidel H. Anisotropic etching of crystalline silicon in alkaline solu- tions, I Orientation dependence and behavior of passivation layers [J]. J Electrochem Soe, 1990,137:3612 -3626. 被引量:1
  • 9姜胜林,江勤,陈实,刘梅冬.UFPA器件微桥腐蚀工艺的研究[J].华中科技大学学报(自然科学版),2007,35(2):74-76. 被引量:1

二级参考文献17

  • 1张维新,毛赣如,姚素英,曲宏伟.多晶硅压力传感器[J].天津大学学报,1996,29(3):466-468. 被引量:4
  • 2[1]TABATA O. Anisotropic etching of Si in TMAH solutions[J] . Sensor & Actuators, 1999, B: 1-2. 被引量:1
  • 3[2]SATO K. Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation [A] . MEMS'98 Proceedings of The Eleventh Annual Iht Workshop [C] . 1998, 556-561. 被引量:1
  • 4[3]TOKORO K. Anisotropic etching properties of silicon in KOH and TMAH solutions [A] . MHS'98 Proceedings of the 1998 Int Symp [C] .1998, 65-70. 被引量:1
  • 5[1]Lee D B. Anisotropic etching of silicon [J]. J Appl Phys, 1969, 40:4569 - 4574. 被引量:1
  • 6[2]Tea N H, Milanovic V, Zincke C A, et al. Hybrid postprocessing etching for CMOS-compatible MEMS[J].J Microelectromechanical Systems, 1997, 6(4): 363 - 372. 被引量:1
  • 7[3]Tabata O. pH-controlled TMAH etchants for silicon micromachining [J]. Sensors and Actuators, 1996, A 53: 335 - 339. 被引量:1
  • 8[4]Tabata O, Asahi R, Funabashi H, et al. Anisotropic etching of silicon in TMAH solutions [J]. Sensors and Actuators, 1992, A 34: 51- 57. 被引量:1
  • 9[5]Tabata O, Asahi R, Funabashi H, et al. Anisotropic etching of silicon in (CH3)4NOH solutions [A]. Anon ed Proc Transducers[C]. San Francisco(USA) : IEEE, 1991. 811- 814. 被引量:1
  • 10[6]Schnakenberg U, Benecke W , Lange P. TMAHW etchantsfor silicon micromachining [A] .Anon ed Proc Transducers[C]. San Francisco (USA): IEEE, 1991. 815-818. 被引量:1

共引文献21

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部