2Kouji Nanbu, Shinji Ozawa, Kazuo Yoshida. Low Temperature Bonded Cu/LCP Materials for FPCs and Their Characteristics[J]. IEEE Trans. Comp. and Pack. Tech. 2005, 28 (4): 760-764. 被引量：1
3D Thompson, O Tantot, H Jallageas. Characterization of Liquid CrystalPolymer (LCP) Material and TransmissionLines on LCP Substrates from 30 to 110GHz [J]. IEEE Trans.Microw. Theory Tech, 2004, 52 (4):1343-1 352. 被引量：1
4Nickolas Kingsley. Liquid Crystal Polymer: Enabling Next Generation Conformal and Multilayer Electronics [J]. Microwave Journal, 2005 (5):188-200. 被引量：1
5Souvik Mukherjee, Bhyrav Mutnury, Sidharth Dalmia. Layout-Level Synthesis of RF Inductors and Filters in LCP Substrates for Wi-Fi Applications [J]. IEEE Trans. Microw. Theory Tech, 2005, 53 (6) 2 196-2210. 被引量：1
7Morgan Jikang Chen, Anh-Vu H Pham, Nicole Andrea Evers.Design and Development of a Package Using LCP for RF/Microwave MEMS Switches [J]. IEEE Trans. Microw. Theory Tech. 被引量：1
8Dane C Thompson, John Papapolymerou, Manos M Tentzeris. High Temperature Dielectric Stability of Liquid Crystal Polymer at mm-Wave Frequencies [J]. IEEE Microw. And Wireless Comp. Letters, 2005, 15 (9):561-563. 被引量：1
9Dane C Thompson, Manos MTentzeris, John Papapolymerou. Experimental Analysis of the Water Absorption Effects on RF/ mm-Wave Active/Passive Circuits Packaged in Multilayer Organic Substrates[J]. IEEE Trans. Adv. Pack. 2007, 30 (3). 被引量：1
10Linas Jauniskis, Brian Farrell, Andrew Harvey. LCP PCB- based Packaging for High-Performance Protection [J]. Advanced Packaging, 2006 (10):40-42. 被引量：1
