摘要
北京科化新材料科技有限公司承担国家科技部"十一五"02重大专项子课题,成功研制出LQFP封装用环保型环氧塑封料KHG700产品,并实现产业化。经过客户验证,批量产品应用达到进口同类产品水平。KHG700产品采用环保阻燃、快速固化和高填料量技术,具有低膨胀率、低粘度、低吸湿性、高可靠性等特点,并具有优良的封装工艺性能,可用于QFP、LQFP、TQFP等类别产品封装。文中对关键封装要求做了重点分析,并详细介绍了塑封料产品配方设计、性能测试、客户可靠性试验结果。
Beijing KEHUA advanced material technology Co., Ltd. got a subsidized item of 02 Project from the Ministry of Science and Technology in the 1 lth 5-year plan and succeeded in the research of green epoxy molding compound （EMC） KHG700 for LQFP package, which is comparable with some kinds of import EMC products. KHGT00 applies some advanced technologies such as green flame resistant, fast cure and high filler percentage and may be used in the molding of QFP, TQFP and LQFR The characteristic of KHG700 is low coefficient of thermal expansion, low viscosity, low moisture absorption, high reliability and good operation performance. The paper analyses the key molding product demands and introduces the formula design, the test data and the result of the reliability test.
出处
《电子与封装》
2012年第6期1-3,15,共4页
Electronics & Packaging
