摘要
电子设备电磁屏蔽效能的好坏直接影响着屏蔽体内电子器件工作的稳定性,而电磁屏蔽体上的孔洞造成的电磁泄漏是一个不容忽视的问题。针对这个问题,对有孔洞的屏蔽体的电磁泄漏进行了仿真计算,定量分析孔洞大小对屏蔽外壳的屏蔽性能的影响。分析结果表明在屏蔽体壁厚保证的情况下,孔洞的直径越小,屏蔽效能越高。当孔洞的半径在10mm以下时,屏蔽效能在30dB以上,满足实际工程要求的屏蔽效能要求。并由此得到屏蔽效能经验公式。
Electromagnetic shielding performance of electronic devices have a direct impact on the stability of the shielding body of the electronic devices, electromagnetic shielding on the holes caused by the electromagnetic leakage is a problem can not be ignored. Addressing this issue, the holes in the shield electromagnetic leak was made simulation,and make quantitative analysis of the impact of the holes on the shielding performance of the shielded enclosure. The analysis results show that the shield wall thickness to ensure that the case, the smaller the diameter of the holes, the higher the shielding effectiveness. When the radius of the hole below 10mm, the shielding effectiveness of more than 30dB,the shielding performance requirements meet actual project requirements.and at last get the empirical formula.
出处
《电子测试》
2012年第6期1-4,24,共5页
Electronic Test
基金
国际科技合作项目(项目编号:2009DFB10570)
关键词
孔洞
电磁屏蔽
ANSYS
屏蔽效能
hole
electromagnetic shielding
ansys
shielding effectiveness
