摘要
航天器电子设备焊点质量靠人工目测和民用全自动光学检测(AOI)系统很难满足未来航天电子产品焊点质量检测的需求。为此,文章提出了航天器电子设备焊点质量检测的新方法,通过三维显微镜与CCD相机提取焊点的图像特征,并与焊点质量评价准则相对应,用计算机自动识别技术进行焊点质量的判别。在此基础上,对焊点质量检测平台的总体方案进行了设计。通过焊点检测技术的研究,采用三维显微镜及CCD成像技术,可以获得焊点多角度、高清晰的图像,在提取焊点特征信息的同时,还可获取印制板信息,可以确保全焊点检测,能够满足航天电子产品的焊点质量判别标准,有效提高航天电子产品的质量控制水平。设计的焊点质量检测平台定位精度小于10μm,可以检测的最大印制板尺寸为450mm×450mm。
Current PCB weld quality detecting methods by manual eyeballing or civil Automated Optical Inspection（AOI） can not satisfy the need of spacecraft standards. So a new inspection method is put forward in this paper. By picking up the picture characteristic of PCB weld with three-dimensional microscope and CCD camera, and comparing with the weld quality evaluation criteria, the weld quality can be distinguished by computer automatic identify technology. At the same time the test platform of weld detecting is designed. By using the three-dimensional micro- scope and CCD camera, the angle shot and high-definition weld picture can be achieved to recog- nize both the weld characteristic and PCB information, which make sure that all of the weld points be detected. The system can satisfy the need of PCB weld quality detecting and effectively improves quality control of electronic product of spacecraft. The weld quality inspection platform orientate precision less than 10 μm, and the maximize size of PCB board is 450mm×450mm.
出处
《航天器工程》
2012年第3期107-112,共6页
Spacecraft Engineering
关键词
航天器
电子设备
焊点
质量检测
平台
spacecraft
electronic product
weld
quality inspection
platform
