摘要
采用TiZrCuB非晶钎料钎焊Si3N4陶瓷,研究了钎料成分、钎焊工艺对接头强度和界面结构的影响.研究结果表明:钎料成分和钎焊工艺对接头室温连接强度有明显影响,在相同钎焊条件下,采用非晶钎料钎焊接头的室温强度比同成分的晶态钎料提高35%;对于TiZrCuB钎料,合金元素Ti的活性大于Zr,接头界面反应层由两部分组成,紧靠陶瓷一侧为TiN层,其余为Zr-Si和Ti-Si化合物层,界面反应层厚度对连接强度的影响存在一最佳值;Ti40Zr25CuB0.2非晶钎料钎焊Si3N4陶瓷接头的高温强度随测试温度升高而降低,当测试温度高于573 K时,其强度急剧下降.
Si3N4 ceramic is brazed with TiZrCuB amorphous filler metal,the effect of component of filler metal and brazing processing parameter on interfacial microstructure and joint strength was discussed.The results show that brazing filler metal composition and the brazing process significantly affect the connection strength of the joints at room temperature.In the same soldering conditions,the room temperature strength increased by 35% with the use of amorphous solders joints than that with the use of crystalline component filler.For TiZrCuB brazing filler,alloying elements Ti has a greater activity than Zr.The connector interface reaction layer is composed of two parts.The TiN layer is close to the ceramic side,and the others are the Zr-Si and Ti-Si compound layers.There is an optimal value for the interfacial reaction layer thickness on the strength of connection.The high temperature strength of Si3N4 ceramics joints using Ti40Zr25CuB0.2 amorphous brazing filler decreased with increasing test temperature.However,when the test temperature is higher than 573K,its strength sharply drops.
出处
《江苏科技大学学报（自然科学版）》
CAS
2012年第2期129-132,共4页
Journal of Jiangsu University of Science and Technology:Natural Science Edition
基金
国家自然科学基金项目资助(50875117)
