摘要
文章应用ZEMAX软件模拟了管芯与光纤在不同偏移量下的耦合效率,并进行了实验验证。结果表明,6.5mm焦距的TO-CAN(晶体管外壳封装)与端面倾斜8°的光纤,在管芯偏移100μm时,耦合效率最大,模拟值为21.9%,实验值为21.32%;5.8mm焦距的TO-CAN与端面倾斜6°的光纤,在管芯偏移80μm时,耦合效率最大,模拟值为11.2%,实验值为10.42%;并且实验结果和仿真结果一致。
Using ZEMAX software,the coupling efficiencies between laser chip and fiber at different offsets are simulated and experimentally verified.The results show that when the chip offset is 100 μm,the coupling efficiency between the TO-CAN with 6.5 mm focal length and 8 ° fiber is the maximum： the simulation value is 21.9% and the experimental value is 21.32%,and when the chip offset is 80 μm,the coupling efficiency between TO-CAN with 5.8 mm focal length and 6 ° fiber is the maximum： the simulation value is 11.2% and the experimental value is 10.42%.In both cases,the experimental results are consistent with the simulation results,which has a certain guiding significance to laser subassembly packaging.
出处
《光通信研究》
北大核心
2012年第2期56-58,共3页
Study on Optical Communications
