摘要
混合厚膜电路工艺加工中,微电子引线焊接既是制造中的关键工艺技术,又是研究最为薄弱之处。混合厚膜功率电路工作温度较高,组件安装温度可达300℃左右,如使用含铅普通低温焊料,整件组装时会导致焊料熔融、引线移位、电路失效,影响焊接可靠性。文章详细介绍了一种引线绕焊技术,通过工艺实验说明了研究过程,结合高低温焊料使用获得较实用的绕焊工艺实施方法和要求,保证了镀银铜线的高温焊接强度,提高了功率及航天电路外引线焊接可靠性。
Microelectronic lead welding is both key processing technology and the weakest point of Hybrid IC research. Hybrid Power circuits maintains high working temperature, the module assembly temperature could reach 300~C; while applied with common solder paste in Lead welding, the high temperature raised during device assembly would cause the internal solder paste to melt, then the leads would move off from their original locations, leading to circuits failure ＆ lowering-down of comprehensive welding reliability. This paper introduced an Lead Circumcolumnar Welding technology, and also described the research course and experiments. Moreover, through many examples and test data, it verified a practical processing method and criterion of Lead Circumcolumnar Welding using varied solder pastes, obtained the welding Specification. Through research, the silver-plated copper wire welding strength has been assured, and the oower ＆ soace aoolication circuits lead weldin~ reliability bein~ ~reatlv imoroved.
出处
《电子与封装》
2012年第2期33-36,43,共5页
Electronics & Packaging
关键词
混合厚膜电路
外引线焊接
绕焊
可靠性
hybrid IC
lead welding
circumcolumnar welding
reliability
