摘要
在880℃/10min规范下,采用AgCuTi活性箔带钎料完成了SiO2f/SiO2/TC4,SiO2f/SiO2/Ti3Al和SiO2f/SiO2/TiAl三种接头的连接,每种接头界面均结合良好。接头显微组织结果表明,三种接头组织形貌较为相似,均在靠近SiO2f/SiO2母材的界面处形成了一层薄薄的扩散反应层组织,在该组织中出现了Ti和O的富集。分析认为,钎焊过程中钎料中的Ti会优先向SiO2f/SiO2母材边缘扩散,同时,金属母材中的元素在液态钎料的作用下不断向钎缝中溶解,其中一部分母材中的Ti也会向复合材料母材边缘扩散,两种不同来源的Ti共同与SiO2发生反应生成Ti-O相,根据三种接头扩散层中Ti和O的原子比例推断Ti-O相为Ti2O。三种接头的钎缝基体区主要由白色组织和灰色组织共同组成,其中白色组织中富含Ag,主要以Ag基固溶体形式存在,而灰色组织中富含Ti和Cu,二者结合生成Ti-Cu组织。
SiO2f/SiO2 composite was successfully joined to TC4,Ti3Al and TiAl using Ag-Cu-Ti brazing foils at 880℃ for 10min and the sound joints were formed.The microstructures of three kinds of joints showed that a thin reaction layer was formed near the surface of SiO2f/SiO2 matrixes where elements Ti and O were enriched.During the brazing,element Ti in the brazing filler as well as a part of dissolved Ti from base metals together diffused to the surfaces near the composites and reacted with SiO2 and finally formed Ti-O phase.According to the atom ratio of Ti and O,it was deduced that the Ti-O phase should be Ti2O phase.The white microstructures and the grey microstructures existed in the three brazing seam.The former was mostly Ag-based solid solution and the latter mainly contained Ti and Cu that formed Ti-Cu phase.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2012年第2期41-44,90,共5页
Journal of Materials Engineering
