摘要
概述了超微细线路PCB的非蚀刻附着性促进处理工艺(NEAP)和使用NEAP工艺处理的附着性机理、表面特性,附着强度,阻焊应用和高频特性。
This paper describes non-etching adhesion promoter（NEAP） treatment process for super fine patterns PCB,and discussed the adhesion mechanism,surface characteristic,adhesive strength,solder mask application and high frequency characteristic treated by NEAP process.
出处
《印制电路信息》
2012年第2期44-48,共5页
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