摘要
文章论述了金锡共晶烧结工艺在功率器件焊接中的应用,分析了金锡共晶烧结温度、时间和压力对芯片粘接质量的影响。同时分析了金锡焊料重熔后粘接层孔隙的变化,试验表明金锡共晶烧结时控制好烧结工艺参数,可以保证多次重熔对粘接层孔隙率的影响,粘接质量能满足相关要求。
In this paper, Au/Sn eutectic sintering technology on the power device packaging application was discussed. The influence of temperature, time and force on Au/Sn sintering were tested in die attach experiments. After Au/Sn sintering to die, Au/Sn sintering to sealing has also been analyzed in the packaging. The result suggests that controlling the sintering parameters will improve the quality of the adhesive layer air- tightness after re-melting. Air tightness and yield rate ofAu/Sn eutectic could be controlled and the packaging reliability will satisfy the need of packaging technology.
出处
《电子与封装》
2011年第12期4-7,共4页
Electronics & Packaging
关键词
金锡共晶
芯片烧结
空隙率
密封
可靠性
Au-Sn eutectic solder
die sintering
air-tightness
hermetic
reliability
