摘要
陶瓷表面经传统钯液活化后化学镀铜层的结合力受Sn2+的影响,且操作麻烦,污染环境,生产成本高。为此,制备了具有催化活性的金纳米液,并将其用于陶瓷化学镀铜前的活化。通过SEM,EDS,XRD及结合力测试讨论了镀液成分、温度及装载量对沉积速度的影响,确定了金纳米活化陶瓷后的最佳化学镀铜工艺参数,并将其与传统钯活化陶瓷化学镀铜进行了对比。结果表明:陶瓷基体经金纳米活化后进行化学镀铜,可以得到更加致密均匀、结合力好的镀层。
Nanoscale gold activation fluid with catalytic activity was formulated and used for activation of ceramics before electroless Cu plating.The effects of bath composition,temperature and loading capacity on the deposition rate of electroless Cu coating were analyzed using a scanning electron microscope,an energy dispersive spectrometer,an X-ray diffractometer and a bonding strength meter.The optimized condition for electroless Cu plating of ceramics activated by nanoscale Au was established,and the performance of as-prepared coating was compared to that of electroless Cu coating of ceramics activated by Pd.Results show that a compact and homogeneous Cu coating with good adhesion can be prepared via electroless plating on ceramics activated by nanoscale Au.
出处
《材料保护》
CAS
CSCD
北大核心
2011年第12期36-39,2,共4页
Materials Protection
基金
山东省科技发展计划(2010G0020318)
山东省自然科学基金(ZR2010EM062)
济南市高校自主创新计划(201004048)
山东省优秀中青年科学家科研奖励基金(2008BS04031)
关键词
陶瓷
活化
金纳米粒子
化学镀铜
镀层结合力
镀层组构
ceramics
activation
nanoscale gold
electroless copper plating
adhesion
microstructure of coating
