摘要
甚短距离光互连技术作为一种突破铜线互连传输瓶颈有效方法,受到了广泛关注。半导体光学器件技术、高速化集成电路技术和光电模块封装技术作为实现光互连的关键技术发展较为迅速。首先阐述了垂直腔面发射激光器的电路模型,然后针对光信号发送模块介绍了预加重补偿技术以及开环方式稳定光功率输出技术,并对如何提高光信号接收模块带宽性能的电路技术进行了分析。其次结合光互连模块技术标准的发展,以NEC公司的实用化甚短距离并行光互连模块为例,对其光电封装技术进行了说明,最后就甚短距离光互连技术所面临的课题及发展前景进行了总结。
The very short reach optical interconnection technology as an effective proposal breaking the transmission bottleneck of copper interconnection is receiving extensive attention.As key technologies for achieving optical interconnection,optical semiconductor device technology,high speed integrated circuit technology and optoelectronic module packaging technology show rapid development.Firstly,the circuit model of vertical cavity surface emitting laser is discussed,and then pre-emphasis compensation and open loop type optical output stabilization technology for the optical transmitter module are introduced.And the circuit technology improving the bandwidth performance for optical receiver module is analyzed.Secondly,with the development of optical interconnection module technology standards,taking practical very short reach parallel optical interconnection module from NEC corporation as an example,its optoelectronic packaging technology is examined.Finally,the facing technical challenges and prospects about the very short reach optical interconnection are summarized.
出处
《半导体技术》
CAS
CSCD
北大核心
2011年第10期737-742,共6页
Semiconductor Technology
基金
山东省自然科学基金项目(ZR2010FM011)
教育部留学回国人员科研启动基金资助项目(教外司留[2010]609号第38批)
关键词
甚短距离光互连
带宽
垂直腔面发射激光器
预加重补偿
光电封装
very short reach optical interconnection
bandwidth
vertical cavity surface emitting laser（VCSEL）
pre-emphasis compensation
optoelectronic packaging
