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核壳结构聚苯乙烯/银复合粒子的制备研究 被引量:1

Fabrication of PS/Siller Core-shell Composite Particle
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摘要 采用化学镀法,将金属Ag粒子致密镀覆在自制聚苯乙烯微球表面,制备了具有高导电特性的PS/Ag复合粒子,通过正交实验优化了制备工艺。结果表明:表面粗化处理、AgNO3/PS质量比和NH3.H2O浓度3个因素对复合粒子的体积电阻率产生了重要影响;粗化处理在PS微球表面引入了磺酸基团,提高了PS微球表面的电负性和亲水性,对包覆过程起到了很好的促进作用;当AgNO3/PS质量比为1∶2,NH3.H2O,PdCl2和甲醛的用量分别为60mL/L,0.2g/L,10mL/L时,制备的Ag/PS复合粒子体积电阻率降低至1.12×10-4Ω.cm。 Employing electroless plating, PS/Ag composite with characteristic of high conductivity were fabricated via coating metallic Ag particles on the surface of polystyrene (PS) microspheres synthesized using dispersion poly- merization, in which orthogonal experiments were designed. Experimental results revealed that three factors, i.e. surface coarsening, mass ratio of AgNO3 to PS, and concentration of NH3·H2O, played significant roles on influence the pv values of products. In terms of surface coarsening, sulfonic group were fixed on the surface of PS after the microspheres were processed in sulfate aqueous solution, promoting the coating sequence by enhancing their electro-negativity and hydrophilicity. Besides, in the optimum configuration of AgNO3/PS mass ratio of 1 :2, NH3 H2O concent and PdC12 concentration, formaldehyde concentration are 60 mL/L,0.2 g/L and 10 mL/L respectively, the volume resistivity of the prepared Ag/PS composite reduce to 1.12 × 10^-4Ω·cm.
出处 《表面技术》 EI CAS CSCD 北大核心 2011年第5期69-72,共4页 Surface Technology
基金 国家自然科学基金资助项目(50025309) 山西省科技攻关项目(20110321037-02)
关键词 导电材料 Ag/PS复合粒子 分散聚合 化学镀 conductive materials Ag/PS composite dispersion polymerization electroless plating
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