摘要
研究了一种绿色环保的铁基元件直接电镀铜新工艺.通过使用两种添加剂,增加焦磷酸钾量,增强铜离子还原过程的阴极极化,使铜的析出电位低于铁基体的表面活化电位,从而获得与铁基体具有良好结合强度的电镀层,改变了传统工业应用中必须经过预镀氰铜或浸镀,从而可简化工艺,降低成本.通过三因素三水平正交试验,在保证镀层质量的前提下以镀铜速率为衡量标准,获得了比较好的工艺条件.对镀液温度、电流强度及pH对镀铜速度的影响进行了分析.
A green and environment-friendly process of copper electroplating directly on iron substrate is studied. With the addition of special additives and increase of potassium pyrophosphate, the cathodic polarization of Cu ion is strengthened in the reduction course making the deposited potential of Cu lower than the surface activation potential of iron subtrate. Thereby, a qualitified plating layer with good bond strength to iron substrate surface has been Obtained. Avoiding of cyanide preplating or dipping pretreatment in tranditional industry application, the new copper electroplating process is of simplification and low cost. The optimum operation condition is obtained by the orthogonality experiments and the differential effect of significant factors on the rate of copper plating has been discussed.
出处
《南开大学学报（自然科学版）》
CAS
CSCD
北大核心
2011年第4期77-80,共4页
Acta Scientiarum Naturalium Universitatis Nankaiensis
基金
中央高校基本科研业务费项目(65010451)
天津市科技发展计划(05YFSYSF030)
关键词
铁基
无氰
电镀铜
iron substrate
no cyanide
copper electroplating
