摘要
采用非等温差示扫描量热(DSC)法对纳米二氧化硅/环氧树脂/双马来酰亚胺/氰酸酯(nano-SiO2/EP/BMI/CE)树脂进行了固化反应动力学和固化工艺研究。通过Kissinger法和Ozawa法求得了nano-SiO2/EP/BMI/CE树脂体系固化反应动力学的表观活化能。结果表明:改性CE树脂体系的固化工艺参数为凝胶温度112℃、固化温度195℃及后处理温度213℃,进而确定了改性CE树脂体系的最佳固化工艺条件为"150℃/3 h→180℃/3 h→200℃/2 h";改性CE树脂体系的平均表观活化能为59.90 kJ/mol。
The curing reaction kinetics and curing process for an EP（epoxy resin）/BMI（bismaleimide）/CE（cyanate ester）resin modified by nano-SiO2 were investigated by non-isothermal differential scanning calorimetry（DSC）. The apparent activation energy of curing reaction kinetics for nano-SiOJEP/BMI/CE resin was calculated by Kissinger method and Ozawa method. The results showed that the curing process parameters（such as the gelling temperature at 112 ℃,curing temperature at 195 ℃ and post-treatment temperature at 213 ℃） of modified CE resin system were obtained, and the optimal curing process conditions of modified CE resin system were ascertained for ＂150 ℃/3 h→180℃/3 h →200 ℃/2 h＂. The average apparent activation energy of modified CE resin system was 59.90 kJ/mol.
出处
《中国胶粘剂》
CAS
北大核心
2011年第8期1-4,共4页
China Adhesives
基金
西北工业大学2011年度研究生创业种子基金(Z2011010)
