摘要
为研究建陶坯体干燥过程中的传热性能,使用导热系数测试仪对不同排水率下的建陶坯体的导热系数进行了实验研究;为降低接触热阻的影响,在坯体与铜板间涂以导热胶,最后对实验误差进行了分析。实验结果表明,坯体导热系数随温度线性增加,随着排水率的增加而减小。
Building ceramic bodies with different moisture elimination rates were tested with a thermal conductivity meter to determinate their thermal capability. Thermally conductive adhesive was applied between the copper flat and the ceramic body to reduce the impact of contact thermal resistance, and the experimental error was analyzed. The experimental result indicates that, with the increase of moisture elimination rate, the thermal conductivity increases, and it increases linearly as temperature increases.
出处
《陶瓷学报》
CAS
北大核心
2011年第2期239-242,共4页
Journal of Ceramics
基金
景德镇科研项目(编号:景科字{2008}39))
关键词
建陶坯体
排水率
导热系数
实验研究
误差分析
building ceramic
moisture elimination rate
thermal conductivity
experiment
error analysis