摘要
评述了当前封装技术的特点以及应用， 介绍了多芯片组件、突点互连技术、球栅阵列、板上芯片。
Advanced packaging technologies are taking place of traditional packaging processes.This article is concerned with the feature and application of advanced packaging technologies,which include chip scale package,multichip module,micro ball grid array,chip on board,chip on flex,flip chip on board and flip chip on flex.
出处
《半导体技术》
CAS
CSCD
北大核心
1999年第6期7-9,共3页
Semiconductor Technology
关键词
多芯片组件
封装
微球栅阵列
Multichip module Chip scale package Micro ball grid array Chip-on-board
