摘要
清洗是PCB组装中的一道重要工序,它对电子产品的质量和可靠性起着极为重要的作用。对于高性能电子产品,不论是通孔插装还是表面组装,在回流焊、波峰焊或浸焊后,基板及其组件都需要进行严格有效的清洗,以去除助焊剂残留物和各种污染物。特别是对于表面组装工艺,由于助焊剂可进入表面组装元器件和基板之间的微小空隙中,从而使清洗显得更为困难也更显重要。主要介绍了PCB组件电装生产中清洗的必要性和常见的清洗方法,着重论述了对PCB半水清洗机的试验及应用。
Cleaning is an important process during PCB assembly,and it impacts the quality and reliability of electronic products.Strict and effective cleaning for base board and component of high performance electronic product must be done to remove flux residue and pollutant after reflow soldering,wave soldering or dip soldering,no matter whether it is assembled by through hole or surface mounted technology,especially during surface mounted assembly,flux may get into the tiny gaps between the components and base board,which makes the cleaning even more challenging and crucial.The necessity of cleaning and some common cleaning methods in the PCB assembly production are introduced.The experiment and application of PCB semi aqueous cleaning are discussed.
出处
《电子工艺技术》
2011年第4期205-209,共5页
Electronics Process Technology
关键词
焊接工艺
残留物
清洗工艺
半水清洗
Soldering technology
Residue
Cleaning technology
Semi aqueous cleaning
