摘要
聚酰胺酰亚胺(PAI)是聚酰亚胺(PI)的一种重要改性树脂。与聚酰亚胺相比,其在粘接性、耐磨性、蠕变性、易加工成型性等方面均有很大提高。本文介绍了它的用途、结构性能、合成方法和研发新进展。阐述了我国应有更多的研发团队涉足此类高端新材料开发的观点。这样,才能加速解决诸如液晶产业链等上游产品的瓶颈问题。
Polyamide-imide (PAl) is a important modified resin of ployimide. Compared with polyimide, PAI has been much improved in the performances as in adhesion, wearing-proof, creeping and shaping. The application, structure and characteristics, synthsis method as well as state-of-the-art status in RgaD were summarized. A view that there should be more developing teams in this high end materials in China was proposed. Only in this way, can we eventually solve the bottleneck problem encountering in upper stream products in industry chain like LCD.
出处
《信息记录材料》
2011年第3期42-47,共6页
Information Recording Materials