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不同工艺制备的铁电薄膜底电极Pt/Ti 被引量:5

Pt/Ti Bottom Electrodes of Ferroelectric Thin Films Fabricated by Electron Beam Evaporating and DC-Sputtering
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摘要 采用高真空电子束蒸发与直流溅射在SiO2/Si基底上制备Pt/Ti底电极,对Pt/Ti在不同热处理温度下的结构与形貌进行对比研究。结果表明:由于采用不同的制备工艺,Pt晶粒在成核与生长方式上有所不同,导致了Pt薄膜在结构与形貌的差异。高真空电子束蒸发的Pt薄膜以织构的方式生长,致密而规则的柱状晶粒决定了它在高温下的连续性和稳定性,为制备高质量的铁电薄膜与其性能的研究提供了条件。 The microstructures and morphologies 0f Pt/Ti electrodes produced by ultra-high vacuum (UHV) electron beam evaporating and dc-sputtering at various temperatures have been investigated using X-ray diffraction, scanning electron microscopy and atomicforce microscopy. The results indicate that the microstructures and morphologies of Pt/Ti electrodes are dependent on the variousgrowing modes of Pt/Ti crystal grains. A dense columnar grain structure and texture were observed as a resu1t of electron beam vaporation. UHV electron beam evaporation results in a continuous and stable Pt/Ti film at high temperatures and is reccomended as a bottom electrode processing method for the preparation of ferroelectric thin films with fine properties.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 1999年第5期305-309,共5页 Rare Metal Materials and Engineering
基金 国家"863"!715-002-0110 国家自然科学基金!6973020
关键词 薄膜 织构 底电极 铁电薄膜 Pt film, texture, bottom electrode, ferroelectric thin film
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