摘要
微电子行业的迅速兴起,对铜系材料提出了更高的要求。铜系材料部件的小型化、复杂化使得金属粉末注射成形工艺得到了越来越广泛的重视。介绍了金属粉末注射成形工艺及其应用,从纯铜、铜合金、铜复合材料3个方面阐述了金属粉末注射成形工艺的国内外发展近况。
As the rapid rise of the microelectronics industry, higher requirements are put forward for the copper-based materials. The process of metal injection molding（MIM） is gaining increasing attention because of the more and more small and complex of the copper-based materials parts. The process andapplication of metal injection molding are introduced, then the research status and progress of metal injection molding are reviewed in the sequence of pure copper, copper alloys and copper composites.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2011年第7期85-88,共4页
Materials Reports
基金
昆明市科技合作重点项目(昆科计字08H130102)
