摘要
为了解无铅玻璃粉中各组分含量对玻璃粉性能的影响,采用正交实验法对各组分含量进行筛选,得到流动性为32.80 mm、转变温度为446℃的性能较好的无铅低熔玻璃粉,其组成为:w(Bi2O3)62.7%、w(B2O3)18.8%、w(ZnO)1.5%、w(碳族氧化物A)6.0%、w(碳族氧化物D)8.0%。以该玻璃粉与银粉和乙基纤维素松油醇溶液配制银导电浆料,在多晶硅片上经720℃烧渗。结果表明,得到的银层表面光洁,厚为(15±3)μm时,方阻为4.2×10–3Ω/mm2,附着力为4 N,能满足硅基电子元器件的使用要求。
To understand the effect of amounts of lead-free frits components on its property,amounts of lead-free frits components were selected by the orthogonal experiment method.A kind of lead-free frit which composed of w（Bi2O3）62.7%,w（B2O3）18.8%,w（ZnO）1.5%,w（A）6.0%,w（D）8.0% was fabricated,its flow ability is 32.80 mm and transition temperature is 446 ℃.The silver conducting paste composed with the frit,silver powder and ethyl cellulose terpineol was prepared,then sintered on polysilicon chip at 720 ℃.The results show that the sintered Ag films appear bright and flat,its square resistivity and binder force with a thickness of（15±3） μm are 4.2×10–3 Ω/mm2 and 4 N,respectively.It can meet the requirement of Si-based electronic devices.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第5期53-56,共4页
Electronic Components And Materials
关键词
无铅银导电浆料
玻璃粉
转变温度
方阻
lead-free silver conducting paste
frit
transition temperature
square resistivity
