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基于可重构SoC电路的验证和应用

A Validation and Application System Based on Reconfigurable SoC Chip
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摘要 文章介绍了一款新型可重构SoC电路,较详细地描述了它的内部结构和特点,并制定应用方案,分别重构SPI和DDS模块,对该电路进行验证。应用方案中,利用SPI与VS1003连接,通过该SPI接口控制并发送歌曲数据给VS1003,VS1003对数据进行解码处理,最后驱动功放播放歌曲。利用DDS模块产生信号数据,经过D/A转换,输出正弦信号。通过CPU对相应的寄存器进行配置,规模达到20万门的可重构电路可以工作在200MHz。验证结果表明该电路已具备可重构能力,可以满足市场应用需求。 A new reconfigurable circuit is introduced,the hardware frame and characters are described in detail.The application system reconstructing SPI and DDS modules into the reconfigurable unit is designed for its certification.For the application: By the SPI interface connecting to VS1003,VS1003 is controlled and receive song data from CPU,these data is decoded in VS1003 and drives amplifier to play song;DDS module is used to generate signal data,passing through A/D convertor,these data is transformed to sine signal.The unit,with 2 million system gates,can work with 200MHz by being set some registers by CPU.The conclusions that the chip has a very ability of reconfiguration design and satisfies the application requirement of market are made after the experimentation.All of them also could afford some technical assists for more progress in this field in the future.
出处 《电子与封装》 2011年第4期17-20,共4页 Electronics & Packaging
关键词 可重构技术 SOC FPGA DDS SPI reconfigurable SoC FPGA DDS SPI
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