摘要
利用相场模型与溶质场、温度场进行耦合计算,以Ni-40.83%Cu合金为例模拟了二元合金枝晶生长过程.系统研究相场模型中相场和温度场耦合强度对枝晶形貌和浓度分布的影响.模拟结果表明:随着耦合强度的增加,相场受温度场的影响加大,界面前沿变得不稳,扰动被放大,主枝上出现了二次枝晶.同时,枝晶尖端的生长速率增大,而枝晶尖端的曲率半径减小,枝晶前沿的溶质富集现象也更严重;另外,计算结果与Ivantsov理论符合较好.
Phase-field model is used and The dendrite growth of a Ni-40.83% Cu binaryalloy under were simulated by the model coupled with solute field and temperature field.The effects of solidification latent heat on the growth of equiaxed dendrite,distribution of solute field and temperature field in undercooled liquid alloy were analyzed.The results indicate that the dendritic has well-developed secondary arms as undercooling degree increases.Correspondently,the solute Peclet number and the tip speed increases,the tip radius decreases,and the solute segregation in solid-liquid interface increases.The results agree well with Ivantsov theory.
出处
《物理学报》
SCIE
EI
CAS
CSCD
北大核心
2011年第4期86-91,共6页
Acta Physica Sinica
基金
国家自然科学基金(批准号:50975263)
山西省留学基金(批准号:2010-78)
山西省人事厅留学项目
山西省国际科技合作项目资助的课题~~
