摘要
介绍了利用红外热成像技术诊断印制电路板故障的原理及系统的硬件组成和软件设计。该诊断方式新颖，具有直观、非接触性、诊断速度快和准确性高等特点。
The principle that applies infrared thermal imaging to diagnose printed circuit board is introduce. The hardware structure and software design of this system are discussed. This diagnosis method is novel, visual, rapid, non-contact and accurate.
出处
《红外技术》
CSCD
北大核心
1999年第5期43-45,共3页
Infrared Technology
