摘要
提出了一种基于电子散斑干涉(ESPI)技术的快速评价半导体器件可靠性的新方法。通过给试件施加序进的加速温度应力,采用ESPI技术测量其封装离面位移随温度变化的规律预测其工作寿命。对简单半导体器件样品进行了实验,得到了散斑条纹图随试件温度的变化规律,根据变化规律快速提取出了试件的激活能,推算出了试件常温条件下的工作寿命。实验结果与相关资料数据吻合,验证了本文方法的可行性。
Due to the increasing complexity of the packing materials,processes and functions,it′s difficult to quickly and accurately evaluate the reliability of semiconductor devices.To solve this problem,a new method based on electronic speckle pattern interference（ESPI） technology is introduced in this paper.This method predicts the specimen life time according to the change of out-of-plane displacement from field of semiconductor devices packing under the accelerated temperature stress.The law of speckle candy-stripe varying with specimen temperature was got with the tests of simple semiconductor specimen.Then the activation energy of specimen could be extracted rapidly according to the law,and the working life time of specimen at normal temperature could also be obtained.Experimental results meet the data in reference documents closely,which demonstrates the feasibility of the proposed method.
出处
《光电子．激光》
EI
CAS
CSCD
北大核心
2011年第3期352-354,共3页
Journal of Optoelectronics·Laser
基金
广西科学技术厅资助项目(桂科基0731017)
关键词
电子散斑干涉(ESPI)
离面位移
激活能
寿命预测
electronic speckle pattern interference（ESPI）
out-of-plane displacement
activation energy
life time predicting
