摘要
通过填料预分散法和原位聚合法合成了一种BaTiO3填充的热塑性聚酰亚胺树脂。考察不同填充量的填料对热塑性聚酰亚胺的力学性能,热性能和电性能的影响。结果发现:随着BaTiO3添加量的增大,TPI的介电常数和介电损耗都增大,力学性能急剧下降,尤其是柔韧性急剧降低;玻璃化转变温度不变,热分解温度相应增加,热膨胀系数减小,吸潮率降低,TPI与铜箔之间的粘接力减少。
A series of thermoplastic polyimide/BaTiO3 composite was synthesised by in-situ polymerization. The effect of BaTiO3 loading on the mechanical, thermal and electronic properties of thermoplastic polyimide(TPI) were researched. The results showed that: with the increased loading of BaTiO3,the dielectric constant(Dk) and the dissipation fator(Df) increased; the Td,CTE,water effecient and the adhesion between TPI and the copper foil decreased, Tg keep a constant.
出处
《覆铜板资讯》
2011年第1期18-21,36,共5页
Copper Clad Laminate Information
