摘要
利用AN SY S软件建立有限元模型,并合理地设置边界条件,对铝合金周向包封陶瓷过程的温度场进行数值模拟,得到了温度场的分布和变化规律。将模拟结果与实测结果相比较,表明模拟结果与实测结果吻合得较好,为下一步的应力场模拟提供了温度场条件。
By establishing the finite element model and setting the reasonable boundary conditions, the temperature fields on aluminum alloy, ceramics and metal mold in the process of ceramics wrapped by aluminum alloy have been simulated by ANSYS software. The simulation result coincided well with the experimental result. The work has laid the basis for thermal stress analysis.
出处
《机械工程与自动化》
2011年第1期33-35,38,共4页
Mechanical Engineering & Automation
关键词
ANSYS软件
铝合金
陶瓷
金属模具
温度场
ANSYS software
aluminum alloy
ceramics
metal mold
temperature field
