摘要
针对电子组装过程中无铅钎焊工艺在实际生产中出现的缺陷进行了分析研究,找出导致焊点表面粗糙、焊锡珠、漏焊、空洞、钎焊点合金层退变等钎焊缺陷的原因,通过反复试验,提出解决问题的方法,经生产实践证明,这些方法行之有效。
The defects of lead-free soldering process in actual production were discussed,the reasons for soldering joint defects,such as,rough appearance of solder joints,soldering balls,solder skips,voids,degeneration of intermetallic compounds,etc.were found out.The measurements for above defects were proposed by repeated experiments.It is proved that the measurements are effective and have certain guiding significances for solving problems appearing in actual production.
出处
《热加工工艺》
CSCD
北大核心
2011年第1期146-148,共3页
Hot Working Technology
关键词
无铅钎焊
钎焊点缺陷
lead-free soldering
soldering jont defect
