摘要
微机电系统(Micro Electromechanical System,MEMS)作为微电子技术应用的新突破,促进了现代信息技术的发展。牺牲层技术是MEMS应用的关键。介绍了光敏性聚酰亚胺作为牺牲层材料的优势,研究了工艺中光敏聚酰亚胺的厚度控制、亚胺化过程以及牺牲层的去除。并讨论了各工艺的最优化,制备了性能稳定的悬桥结构。
With the application in the microelectronics technology,MEMS（Micro Electromechanical System） has promoted the development of modern information technology.The technology of sacrificial layer is the key in MEMS.In this paper,the advantages of photosensitive polyimide materials as a sacrifice layer is described,not only the process of controlling the thickness of polyimide,imidization process,as well as the release of the sacrificial layer were discussed,but also the hanging bridge structure was prepared.To obtain the stable bridge structure,the fabrication process of sacrificial layer was optimized.
出处
《微处理机》
2010年第5期10-12,16,共4页
Microprocessors
基金
电子薄膜与集成器件国家重点实验室开放基金(KFJJ200805)
关键词
牺牲层技术
光敏聚酰亚胺
亚胺化
牺牲层释放
Sacrificial layer technology
Photosensitive polyimide
Imidization
Release of acrificial layer
