摘要
在电子设备的使用中,会遇到各种苛刻环境条件,如潮湿、酸雨和盐雾等。在这种情况下,器件可能因电化学腐蚀而缓慢失效,也可能因水汽渗入而性能劣化。因此,对器件进行性能优良的气密性封装,有效保护器件免受外界环境的影响至关重要。平行缝焊是最常用的气密性封装方法之一,属于电阻焊。传统的平行缝焊设备单个焊接效率低下,为了提高焊接效率,提出了带阵列焊功能的平行缝焊机。
Electric equipments maybe used in various of environment,for example,humidity,acid rain,salt mist and so on.The devices will be invalidation due to caustic electrochemistry and water vapor.Hermetical seal is used to weld the frame and lid of package.That the devices are sealed hermetically is important which can protect devices from environment.The parallel sealing is a resistance welding.The Sealing of single package is inefficiency in traditional.Introduce the parallel sealing with array in order to improve sealing efficiency.
出处
《电子工艺技术》
2010年第6期365-368,共4页
Electronics Process Technology
关键词
阵列焊
平行缝焊
微电子组装
Array sealing：Parallel sealer
Micro-electronic assembly
