摘要
】介绍了用半导体电堆制冷低噪声放大器的原理、结构和特点，并从结构方面详细阐述了安装、传热。
This paper summarized the principle, structure and features of semiconductor thermoelectronic cooling low noise amplifier. The utility key technologies about installation, heat conduction and heat insulation are fully described.
出处
《低温与超导》
CAS
CSCD
北大核心
1999年第2期16-20,共5页
Cryogenics and Superconductivity
关键词
半导体制冷
制冷电堆
低噪声放大器
热损耗
Semiconductor thermoelectronic cooling, Low noise amplifier, Cooling electronic lump, Equivalent noise temperature, Heat loss.
