摘要
随着社会对技术创新需求的增长,以前主要用于装饰性制品的非金属电镀技术,现在已经成为重要的功能性镀层电镀技术,从而在现代制造中有了新的应用。特别是在现代电子产品制造中,以非金属材料代替有色金属材料将成为流行趋势,而非金属材料的电镀,也就成为支持这种材料变化的重要的电镀技术。介绍了非金属电镀在电子产品等结构材料中的应用情况。
With the increase in social demands for technical innovation,nonmetallic substrate plating technology,which used mainly for decorative products before,has become an important plating technology for obtaining functional coatings now and finds a new application in modern manufacturing industry.As the substitution of nonmetallic materials for nonferrous materials,in electronic products,manufacture will become a prevailing trend,nonmetallic substrate plating method just becomes an important technology for supporting this material change.In this paper,the application of nonmetallic substrate plating method in structure materials including electronic products was introduced.
出处
《电镀与精饰》
CAS
北大核心
2010年第11期27-30,共4页
Plating & Finishing
关键词
非金属
电子制造
电子电镀
nonmetal
electronics manufacturing
electronic plating
