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Bi_2Te_3基半导体合金的结构与性能 被引量:5

Properties and Microstructures of Bi_2Te_3-based Smiconductor Alloys
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摘要 采用粉末热挤压的方式制备出了n型Bi2Te3基块体材料,研究了烧结工艺对其微观结构、力学性能和热电性能的影响。结果表明,与区熔单晶相比热挤压试样的力学性能有了较大提高,挤压温度的提高有利于试样力学性能的改善,挤压温度为400℃时试样获得室温下最大的热电优值约为0.75。 N-type Bi2Te3 bulk thermoelectric alloys were prepared by hot extruded.The effects of hot extrusion crafts on the properties and microstructures were studied.The results show that compared with the single grains,the mechanical properties of hot extruded samples are greatly improved.The ZT value up to 0.75 when the extrusion temperature at 400 ℃.
出处 《武汉理工大学学报》 CAS CSCD 北大核心 2010年第19期5-7,共3页 Journal of Wuhan University of Technology
基金 国家高技术研究发展计划("863"计划)(2007AA03Z232)
关键词 热挤压 力学性能 BI2TE3 hot extrusion mechanical properties bismuth telluride
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参考文献10

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