摘要
以SSOP-20L集成电路塑封为例,运用Moldex3D软件建立CAE模型.用此方法建立的CAE模型与物理模型具有较好的相似性,可作为IC塑封模拟金线变形和芯片偏移的基础模型,并可预见塑封过程中可能发生的问题,为模具浇注系统的设计提供可靠依据.
Takeing plastic encapsulation of SSOP-20L as an example,a CAE model was built based on Moldex3D software.The CAE model established by the method presented a good similarity with the entity,which can be used as a base model for simulating plastic deformation and chip offset,forecasting problems occurred in the process of packaging and providing reliable references for casting model designs.
出处
《上海工程技术大学学报》
CAS
2010年第3期253-256,共4页
Journal of Shanghai University of Engineering Science
基金
上海市教委科研创新资助项目(08YZ156)
