摘要
本文以亚氨基二乙酸为络合剂,次磷酸钠为还原剂,在酸性条件下研究了镀液组成对化学镀铜沉积速率和镀液稳定性的影响。结果表明:化学镀铜的沉积速率随着温度、硫酸铜浓度和次磷酸钠浓度的增加而升高,随着亚氨基二乙酸浓度和镀液pH的增加而降低。极化曲线试验结果表明:随着镀液pH的降低,阴极还原峰电位正移,峰电流密度增大,加速了铜络离子的还原,提高了化学镀铜的沉积速率。采用扫描电镜和原子力显微镜观察了镀层形貌。
The effects of electrolyte composition on copper deposition rate and solution stability were investigated in acid electroless copper plating system with iminodiacetic acid as complexing agent and sodium hypophosphite as reducting agent.The results indicated that the deposition rate was enhanced with the increase in reaction temperature and concentrations of copper sulfide and sodium hypophosphite,while the deposition rate was decreased with the increase in iminodiacetic acid concentration and pH value.With the decrease in pH value,the cathodic reduction peak potential shifted positively,and the peak current density increased.Meanwhile the reduction of copper complex ions was accelerated,and the deposition rate of copper was improved.The morphology of the deposits was examined by scanning electron microscopy and atomic force microscopy.
出处
《电镀与精饰》
CAS
北大核心
2010年第10期5-8,共4页
Plating & Finishing
基金
国家自然科学基金资助项目(20873080)
关键词
化学镀铜
络合剂
亚氨基二乙酸
次磷酸钠
electroless copper plating
complexing agent
iminodiacetic acid
sodium hypophosphite
