摘要
采用传统固相工艺制备了Ba3.99Sm9.34Ti18O54(BSTO)微波介质陶瓷,研究了烧结助剂CuO对BSTO的结构及介电性能的影响。结果表明,添加CuO能较好促进BSTO晶粒致密化,降低烧结温度约140℃。当添加质量分数1.0%的CuO时,1220℃保温3h烧结的BSTO样品的介电性能较好:εr=86.87,Q·f=5138GHz(f=4.95GHz),τf=–10.84×10–6℃–1。
Ba3.99Sm9.34Ti18O54 （BSTO） microwave dielectric ceramics were prepared by conventional solid phase method. The effect of CuO additive on the structure and dielectric properties of BSTO ceramics was investigated. The results show that CuO additive reduces the sintering temperature by about 140 ℃ and improve the densification of BSTO ceramic grain. BSTO ceramic samples （w（CuO）=1.0%） sintered at 1 220 ℃ for 3 h possess good dielectric properties of εr=86.87,Q·f =5 138 （f = 4.95 GHz） and τf = –10.84×10–6 ℃–1.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第10期4-6,共3页
Electronic Components And Materials
基金
国防研制资助项目
关键词
微波介质陶瓷
低温烧结
BSTO
微波介电性能
microwave dielectric ceramics
low-temperature sintering
BSTO
microwave dielectric properties
