摘要
采用微型机械电子系统技术制作出了具有高精度、高频响特点的耐高温硅隔离压阻力敏芯片.根据压阻力敏芯片的版图设计结构,基于弹性薄板小扰度弯曲理论计算分析了压阻力敏芯片的结构尺寸和固有频率.采用静电键合工艺将压阻力敏芯片封装在硼硅玻璃环上,形成倒杯式弹性敏感单元,通过有限元仿真分析了玻璃环对压阻力敏芯片性能的影响.根据温度实验数据及计算结果,得到压阻力敏芯片各温度点的热零点漂移的绝对值均小于0.02%FS·℃-1,说明该压阻力敏芯片的准确度等级优于0.1%FS·℃-1,且零点稳定性好.
High temperature silicon-on-insulator piezoresistive pressure sensitive chip,which possesses the properties of high accuracy and high response frequency,is developed by micro electromechanical system technology.According to the sensitive chip mask structure,the structural dimensions and natural frequency of the sensitive chip are evaluated and analyzed based on small deflection bending theory of elastic thin plate.The sensitive chip is packaged on pyrex glass ring to form inverted-cup type elastic-sensitive cell.The pyrex glass ring effect on performance of the sensitive chip is simulated by finite element method.According to the temperatural experiment data and calculation,the absolute values of thermal zero drifts of the sensitive chip under various temperature are all less than 0.02%FS·℃-1,which demonstrates that the accuracy of the sensitive chip gets better than 0.1%FS·℃-1 with fine zero stability.
出处
《西安交通大学学报》
EI
CAS
CSCD
北大核心
2010年第9期59-63,92,共6页
Journal of Xi'an Jiaotong University
基金
国家自然科学基金资助项目(50836004
50905139)
西安交通大学机械制造系统工程国家重点实验室开放基金
机械工程学院青年教师基金资助项目
关键词
微型机械电子系统
硅隔离压阻力敏芯片
硼硅玻璃环
micro electro-mechanical system
silicon-on-insulator piezoresistive pressure sensitive chip
pyrex glass ring
