摘要
采用化学镀工艺在铜基体表面沉积Ni-Cu-P镀层,利用扫描电镜(SEM)和电子能谱(EDX)对Ni-Cu-P镀层的形貌和成分进行了分析。同时,采用极化曲线(PC)和交流阻抗(EIS)研究了常温下Ni-Cu-P镀层在0.1 mol/L,0.001 mol/L的NaCl,Na2SO4,NaNO3和NaNO2电解质中的耐蚀性能。结果表明,在较高浓度下,氯离子和硫酸根离子的活性吸附作用能够促进镀层中Ni的溶解,从而也加速了镀层的表面钝化,在较低浓度下,氯离子和硫酸根离子的活性吸附作用减弱,镀层很难钝化;硝酸根离子和亚硝酸根离子在高浓度和低浓度下均很难使镀层钝化。
Ni-Cu-P coating was synthesized on copper substrate by electroless plating technique.The coating morphology and com-position were characterized by SEM and EDX.The corrosion resistance of Ni-Cu-P coating was studied by PC and EIS.The results show that at a higher electrolyte concentration,Cl-and SO42-ions promote the dissolution rate of Ni by their adsorption,and accelerate the passivation of Ni-Cu-P coating,at lower electrolyte concentration,Ni-Cu-P coating is not easy to passivate as the reducing of the adsorption effect of Cl-and SO42-,NO 3-and NO 2-can not accelerate the passivation of Ni-Cu-P coating either at higher or lower electrolyte concentration.
出处
《辽宁化工》
CAS
2010年第8期794-796,共3页
Liaoning Chemical Industry
基金
北京自然科学基金
北京市教委科研攻关计划支持资助
批准号:KZ200810016006
北京市科学技术委员会
课题编号:Z090009040409003
关键词
化学镀
Ni—Cu—P
耐蚀性能
钝化
Electroless plating
Ni - Cu - P coating
Corrosion resistance
Passivation
