摘要
文章简述了低应力化学沉铜的工艺特点,通过简单的对比实验分析了其与传统化学沉铜的不同,以期加深读者对低应力化学沉铜工艺的理解。
This article introduced the properties of techniques of the SAP electroless copper process briefly, and analyzed the differences between SAP and traditional techniques of electroless copper process by simple comparative experiment to deepen the reader’s understanding of the SAP electroless copper process.
出处
《印制电路信息》
2010年第8期35-39,共5页
Printed Circuit Information
关键词
低应力化学沉铜
ABF
抗剥强度
the SAP electroless copper process
ABF
peel strength
