摘要
采用电磁搅拌和等温挤压的方法,研究了ZA27合金半固态成形的合理工艺参数,分析了电磁搅拌过程中输入电压、搅拌温度、冷却方式以及挤压过程中挤压温度对ZA27合金的半固态显微组织的影响。结果表明,输入电压为180～200V、搅拌温度为465～475℃和急冷的方式可得到近似球形和球形的细小显微组织;挤压温度为390～410℃时,挤压过程中发生动态再结晶,挤压后晶粒变得更加细小、均匀。
Effects of input voltage,stirring temperature,cooling ways and extruded temperature on microstructure of semi-solid ZA27 alloy prepared by electromagnetic stirring and isothermal extrusion were analyzed to obtain optimized processing parameters. The results reveal that nearly fine spherical or spherical grain can be observed in the microstructure of semi-solid ZA27 alloy with stirring at 465~475 ℃ and input voltage of 180~200 V in condition of quenching. Grain size becomes finer and more uniform as a result of occurrence of dynamic recrystallization during extruding process at 390~410℃.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2010年第6期520-522,共3页
Special Casting & Nonferrous Alloys
关键词
半固态成形
电磁搅拌
等温挤压
显微组织
动态再结晶
工艺参数
Semi-solid Forming,Electromagnetic,Isothermal Extruding,Microstructure,Dynamic Recrystallziation,Processing Parameters
