摘要
运用材料消耗工艺定额的基本原理,给出了针对电子装联工艺的材料定额编制方法及计算公式,列举了几种主要电子装联材料如焊膏、焊料条、焊锡丝的定额实例数据。最后。
Introduce the technology of materials consumption quota for circuits assembly,with practices of technological quota formulation for primary material,such as solder paste,solder bar,solder wire and some achievement to perform the quota in Hunan Weisheng Electronic Co.
出处
《电子工艺技术》
1999年第1期17-20,共4页
Electronics Process Technology
关键词
电子装联材料
工艺定额
焊膏
焊料条
焊锡丝
SMT
Circuit assembly Technological quota draft Solder paste Solder bar Solder wire