摘要
设计了一种新型的带有百叶窗的平板式大功率发光二极管(LED)照明装置。该装置采用高导热系数的铝基板作为多颗大功率LED的散热电路板,用0.4mm的铝片作为散热翅片,结合沟槽式微热管构成集发光与散热一体化的输入功率为21W的照明模组,该模组可根据照明亮度要求重构成不同功率的照明装置。对功率为144W的照明装置进行了理论分析与实验研究。根据理论计算,每个照明模组的发热量约为18W,每个照明模组的传热量约为47W;模拟结果表明,在环境温度为30℃,自然对流换热系数为10W/(m2·K)时,LED芯片最高结温Ta=75℃,而实验测得Ta=75.7℃。
A new plate-type high power LED illuminator with louvers is designed. Aluminum plate with high thermal conductivity is applied as radiated circuit plate for high power LEDs, and aluminum stack with 0.4 mm thickness as radiated fins, which make illuminator module with input power 21 W combining with micro grooved heat pipe. The illuminator module is integrated with lightening and radiating. According to lumination requirements, module groups can be reconstructed into illuminators with different input power. Theoretical analysis and experimental research were conducted to a 144 W illuminator. Calculated results indicate the calorific value of one module is 18 W and the heat transfer value is 47 W. The simulated results indicate that the max junction temperature （Ta） of LED chips is 75 ℃ and Ta measured by experiment is 75.7 ℃ when the ambient temperature is 30 ℃ and the natural convection heat transfer coefficient is 10 W/（m2·K）.
出处
《激光与光电子学进展》
CSCD
北大核心
2010年第5期113-119,共7页
Laser & Optoelectronics Progress
基金
国基自然科学基金(50705031
50975096)
广东省自然科学基金(8151064101000058)资助项目
关键词
LED照明装置
数值模拟
散热技术
微热管
LED illuminator
numerical simulation
heat removal technology
micro heat pipe
