摘要
该文模型利用称为"各向异性硬化张量"的二阶张量Φij代替"背应力"Ωij描述材料的各向异性硬化状态,并据此建立起一种形式更为简单的无屈服面统一本构模型,通过引入温度因子θ',使该模型能够预测金属材料在不同应变率和不同温度下的粘塑性力学行为。该文对SnAgCu合金在不同应变率和不同温度条件下的力学行为进行了数值模拟,并与实验数据作比较。比较结果说明:新模型对金属材料力学行为的预测与实验结果相吻合。
A second-order tensor Φi j,called the anisotropy hardening tensor,is used instead of the ＇back stress＇ Ωij to describe the anisotropy hardening of metal materials. Based on this tensor,a unified visco-plastic constitutive model with concise form is established. By introducing the temperature factor θ＇ into this model,it is capable of predicting the visco-plastic behavior of metal materials under different loading rates and temperatures. The modeling to the thermal-mechanical behaviors of SnAgCu alloy is finished,and the numerical calculations are compared with experimental data. The results show that the prediction to the thermal-mechanical behavior of metal materials given by this new model agrees well with some experimental results.
出处
《工程力学》
EI
CSCD
北大核心
2010年第5期166-172,共7页
Engineering Mechanics
基金
航空科学基金项目(20080252006)
关键词
粘塑性力学
无屈服面统一本构模型
各向异性硬化张量
背应力
焊点
visco-plasticity mechanics
unified constitutive model
anisotropy hardening tensor
back stress
solder joint
