摘要
对粘接用银膏(以下简称银膏)的粘接性能进行了分析和研究,主要对偶联剂和增韧剂对粘接强度的影响进行了讨论,通过试验确定了最佳偶联剂和增韧剂及用量,优化了配方,提高了粘接性能。
The article researches and analyzes the bonding performance of silver paste for bonding. And mainly discusses the effects of coupling agent and toughening agent on the bonding strengh. The optimal kind and content of coupling agent and toughening agent were determined, the formulation was optimized and the bonding performance was increased.
出处
《粘接》
CAS
2010年第5期54-55,共2页
Adhesion
关键词
粘接银膏
偶联剂
增韧剂
粘接力
体积电阻率
silver paste
coupling agent
toughening agent
bonding strength
bulk resistivity
