摘要
本文提出了一种在光板测试系统上,开发测试多层板内层导电线路的方法,并探讨了测试网络程序的形成技术和定位测试技术。
This paper advances a new method for testing inner conductive circuit of multilayer board on testing system of board which has not yet been joined by melting together, and discusses the formation technology of the testng network program and the location testing technology.
出处
《计算机与数字工程》
1998年第5期51-54,共4页
Computer & Digital Engineering
