摘要
研究用硫脲浸取金银技术从废弃印刷线路板中回收金银。结果表明,硫脲能够有效地从废弃印刷线路板中浸取金银,最佳浸出条件为固液比为1∶10,搅拌速度为300 r/m in,室温浸取（20-25℃）,浸取时间1h,硫脲浓度为12g/L,Fe^3＋质量分数为0.8%,pH为1.5。最佳条件下,金和银的浸取率分别达91.4%和80.2%。
The hydrometallurgical process for selectively leaching gold and silver from printed circuit boards scrap is investigated.The experiment results indicate that selectively leaching gold and silver from printed circuit board scrap in acid thiourea solution is possible and effective.The optimal leaching condition is： the ratio of solid to liquid is 1∶10,stirring condition 300r/min,leaching temperature 20-25℃,leaching time 1h,thiourea concentration 12g/L,Fe3＋ concentration 0.8%,pH=1.5.The leaching yields of gold and silver are 91.4% and t 80.2% , respectively.
出处
《有色金属》
CSCD
北大核心
2009年第4期90-93,共4页
Nonferrous Metals
基金
上海市科学技术委员会科研计划项目(042312006)
东华大学生态纺织教育部重点实验室开放课题(Eco-KF-2007-08)
东华-溢达棉纺织
染整研究中心研究项目(R005-06)
关键词
冶金技术
废弃印刷线路板(PCBs)
硫脲浸取
金
银
metallurgical technology
printed circuit boards scrap（PCBs）
thiourea leaching
Au
Ag
