摘要
以Ti3AlC2和Cu粉作为原料,在1150℃下原位热压反应制备了具有亚微米层状结构的Ti3C2/(Cu-Al)金属陶瓷材料。XRD、SEM和TEM分析表明,这种亚微米层状结构的形成,归因于Ti3AlC2与Cu的高温反应引发Ti3AlC2层状结构解离、Al原子溶脱,固溶入周围的Cu中形成Cu-Al固溶体,Al溶出后的Ti3AlC2中原始Ti3C2层规律性聚集、最终形成厚度为150nm左右的Ti3C2层与Cu-Al层交替层叠结构。由于这两种结构之间的牢固结合以及Cu-Al相构成的空间网络结构,使得此金属陶瓷材料具有优异的力学性能和电学性能。其抗弯强度超过1200MPa,并具有良好的断裂韧性和导电性。
A sub-micro-layered Ti3C2/（Cu-Al） cermet was prepared by in-situ hot pressing a mixture of Ti3AlC2 and copper powders. The reaction behaviors and microstructures of the cermet were investigated by XRD, SEM and TEM. It was revealed that the molten Cu accelerated Ti3AlC2 to decompose, induced the interracial exfoliation to generate, and consequently formed a sub-micro-layered structure making up of Ti3C2 layers and Cu-Al alloy layers within one Ti3AlC2 grain. This interfacial exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al and the entering of Cu. The removed Al atoms entered into Cu matrix to form Cu-Al alloy. Thus, a sub-micro-layered Ti3C2/（Cu-Al） cermet was fabricated. Both the widths of the Ti3C2 layer and Cu-Al layer were -150 nm. The cermets have excellent mechanical and electrical properties, due to the strong interface bond between Ti3C2 layer and Cu-Al alloy layer. The flexural strength of the cermets with the original Ti3AlC2 volume content of 40%, 50% and 60% was as high as 1105.13, 1241.96 and 1229.06 MPa, respectively. Correspondingly, the fracture toughness was 15.91, 12.87 and 10.62 MPa.m^1/2, respectively.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2009年第A02期487-490,共4页
Rare Metal Materials and Engineering
基金
“973”计划(2007CB714703)
“863”计划(2006AA03Z527)
北京交大重点(2006XZ003)
北京交大人才基金(2008RC039)
